If you’re a CNC Vertical Machining Center enthusiast, working with a precision mold or involved in the production of bathroom products, a Five-Axis Machining Center CNC Machining YS650-5AX can revolutionize your manufacturing process. By utilizing the potentials of this advanced technology, you can achieve enhanced precision, improved efficiency, and expanded capabilities. Whether you are a seasoned professional or new to the world of 5-Axis Machining Centers, here are some valuable tips and tricks to help you maximize your productivity and get the best results: 1. Understand the BasicsBefore diving into the details, it’s essential to have a solid understanding of the fundamentals of a Five-Axis Machining Center. Familiarize yourself with the machine’s specifications, features, and capabilities. Gain knowledge of the different tooling options, workholding strategies, and programming methods associated with this type of machining center. 2. Optimize Tool PathsTo fully harness the potential of a Five-Axis Machining Center, it’s crucial to optimize your tool paths. Make use of CAM software with advanced programming capabilities to generate efficient and smooth tool paths that minimize rapid movements and reduce cycle times. Experiment with different strategies such as adaptive roughing, high-speed machining, and rest machining to achieve optimal results. 3. Proper Workpiece SetupAchieving precision in machining highly depends on proper workpiece setup. Ensure that the workpiece is securely clamped in place, eliminating any chances of movement or vibration during machining. Utilize advanced fixturing techniques and consider soft jaws or custom fixtures to accommodate complex geometries, allowing for accurate and reliable machining. 4. Utilize the Full Range of MotionMake the most of the range of motion offered by a Five-Axis Machining Center. Rotate the workpiece in multiple axes to access hard-to-reach features and eliminate the need for complex setups and multiple machining operations. This flexibility reduces cycle times and increases overall efficiency. 5. Implement Tool and Machine MonitoringTo ensure uninterrupted machining operations and prevent potential issues, consider implementing tool and machine monitoring systems. These systems can detect tool wear, tool breakage, and machine faults in real-time, allowing for timely intervention. Regular maintenance and calibration of the machine are also essential to ensure its optimal performance. 6. Continuous Learning and ImprovementThe field of CNC machining is constantly evolving, and there is always something new to learn. Stay updated with the latest advancements, industry trends, and best practices related to Five-Axis Machining Centers. Attend workshops, seminars, and webinars to expand your knowledge and continuously improve your skills. In conclusion, by following these tips and tricks, you can enhance the performance of your Five-Axis Machining Center CNC Machining YS650-5AX. Keep exploring new techniques, pushing the boundaries, and adapting to the ever-changing landscape of CNC machining to excel in your field. Maximize the potential of this powerful technology and take your manufacturing capabilities to new heights.

EPR (Electron Paramagnetic Resonance) Spectroscopy, also known as Electron Spin Resonance (ESR) Spectroscopy, is a versatile analytical technique used to study materials containing unpaired electrons. Through careful manipulation of the electron spins EPR spectroscopy can provide valuable insights into molecular structure, dynamics, and electronic properties. In this blog post, we will delve into the advantages of EPR spectroscopy and its wide range of applications.   Highly sensitive detection: EPR spectroscopy is extremely sensitive and can detect and characterize paramagnetic species even at very low concentrations. It can identify and quantify trace amounts of free radicals, transition metal ions, and unstable molecular species. This sensitivity makes EPR spectroscopy an invaluable tool for the study of a variety of biological processes such as oxidative stress, enzyme reactions, and DNA damage, as well as for materials research in areas such as physics and materials science.   Structural Information: EPR spectroscopy provides valuable information about the structure and environment of paramagnetic species. By measuring the g-factor (a dimensionless number representing the spin behavior of electrons) and hyperfine splitting (resulting from electron-nucleus interactions), researchers can infer the electronic structure, bond distances, coordination environments, and magnetic properties of the substance under study. This structural insight is essential for understanding chemical reaction mechanisms and for designing and optimizing catalysts and materials with specific properties.   Dynamic process studies: EPR spectroscopy can study dynamic processes in a variety of systems. For example, it can probe the motion and dynamics of spin-labeled biomolecules and is used to study protein folding, membrane dynamics, and enzyme dynamics. By monitoring changes in the EPR signal over time, researchers can gain insight into reaction rates, conformational changes, and molecular interactions. The ability to study dynamic processes in real-time makes EPR an important tool in biochemistry and biophysics.   Non-destructive and versatile: EPR spectroscopy is a non-destructive technique that allows researchers to study samples without altering their integrity or composition. This advantage is particularly important when studying fragile biological samples, where it is critical to maintain the integrity of the sample. In addition, EPR spectroscopy is versatile and applicable to many types of samples, including liquid, solid, gas and biological samples. This versatility allows researchers to address a wide range of scientific questions in different disciplines.   Complementary Techniques: EPR spectroscopy is often used in conjunction with other analytical techniques such as NMR (Nuclear Magnetic Resonance), X-ray crystallography and mass spectrometry. These complementary techniques allow researchers to correlate structural, electronic, and magnetic information to gain a more complete understanding of chemical systems. By combining EPR spectroscopy with other methods, researchers can characterize complex materials and biomolecules in greater detail and with greater reliability.   EPR spectroscopy plays a vital role in modern scientific research, providing unique insights into the structure, dynamics, and properties of paramagnetic species. Its sensitivity, ability to provide structural information, and non-destructive nature make it an indispensable tool in a wide range of scientific disciplines. Through the continued advancement and application of EPR spectroscopy, we can deepen our understanding of the natural world and devise innovative solutions to complex challenges in fields as diverse as chemistry, biology, and materials science.   CIQTEK is a leading EPR spectrometer global manufacturer. Its EPR equipment offers high performance at a competitive price, making it an ideal choice for scientists. Website: https://www.ciqtekglobal.com/   Here are some key advantages of CIQTEK's EPR spectrometers:   1. Affordable Solutions: CIQTEK aims to provide cost-effective EPR spectroscopy equipment without compromising quality. They offer different pricing options to suit various budgets, ensuring researchers get value for their investment. 2. Customizable Configurations: CIQTEK offers flexible EPR instrument setups, which can be tailored to meet specific experimental requirements. Researchers can customize features such as temperature control, multi-frequency capability, advanced spectroscopic techniques (ELDOR and HYSCORE), and compatibility with different sample types (liquids, solids, and biological materials). 3. User-Friendly Interface: CIQTEK's instruments are equipped with intuitive software interfaces, designed to be user-friendly for researchers of all experience levels. 4. Exceptional Customer Support: CIQTEK prioritizes customer satisfaction, providing excellent post-sales support. This includes comprehensive training resources, technical assistance, and access to customer stories and publications, showcasing their global EPR community.  

High-performance lithium copper foil is one of the key materials for lithium-ion batteries and is closely related to battery performance. With the increasing demand for higher capacity, higher density, and faster charging in electronic devices and new energy vehicles, the requirements for battery materials have also been raised. In order to achieve better battery performance, it is necessary to improve the overall technical indicators of lithium copper foil, including its surface quality, physical properties, stability, and uniformity.   Analysis of microstructure using scanning electron microscope-EBSD technique   In materials science, the composition and microstructure determine the mechanical properties. Scanning Electron Microscope (SEM) is a commonly used scientific instrument for the surface characterization of materials, allowing observation of the surface morphology of copper foil and the distribution of grains. In addition, Electron Backscatter Diffraction (EBSD) is a widely used characterization technique for analyzing the microstructure of metallic materials. By configuring an EBSD detector on a field-emission scanning electron microscope, researchers can establish the relationship between processing, microstructure, and mechanical properties.   The figure below shows the surface morphology of electrolytic copper foil captured by the CIQTEK Field-emission SEM5000   Copper Foil Smooth Surface/2kV/ETD Copper Foil Matte Surface/2kV/ETD When the sample surface is sufficiently flat, electron channel contrast imaging (ECCI) can be obtained using the SEM backscatter detector. The electron channeling effect refers to a significant reduction in the reflection of electrons from crystal lattice points when the incident electron beam satisfies the Bragg diffraction condition, allowing many electrons to penetrate the lattice and exhibit a "channeling" effect. Therefore, for polished flat polycrystalline materials, the intensity of backscatter electrons depends on the relative orientation between the incident electron beam and the crystal planes. Grains with larger misorientation will yield stronger backscattered electron signals and higher contrast, enabling the qualitative determination of grain orientation distribution through ECCI.   The advantage of ECCI lies in its ability to observe a larger area on the sample surface. Therefore, before EBSD acquisition, ECCI imaging can be used for rapid macroscopic characterization of the microstructure on the sample surface, including observation of grain size, crystallographic orientation, deformation zones, etc. Then, EBSD technology can be used to set the appropriate scanning area and step size for crystallographic orientation calibration in the regions of interest. The combination of EBSD and ECCI fully utilizes the advantages of crystallographic orientation imaging techniques in materials research.   By using ion beam cross-section polishing technology, CIQTEK obtains flat copper foil cross-sections that fully meet the requirements for ECCI imaging and EBSD analysis on scanning electron microscopes.   The figure below shows the characterization of electrolytic copper foil using the CIQTEK Field-emission SEM5000   Electrolytic Copper Foil Cross-Section ECCI Image Electrolytic Copper Foil Cross-Section Orientation Distribution EBSD technology can not only characterize the grain size and dimensions but also reveal information about the material's texture type, grain boundary proportion, etc. By studying the microstructural evolution of electrolytic copper foil through ion beam sample preparation combined with SEM and EBSD techniques, it is of great significance to evaluate the differences in processing effects, further optimize the electrochemical properties of materials, improve battery cycle life, and even promote the development of lithium-ion battery technology.

Application of TCT Temperature Cycle Chamber in Optical Communication Industry The arrival of 5G makes people feel the rapid development of mobile Internet, and optical communication technology as an important basis has also been developed. At present, China has built the world's longest optical fiber network, and with the continuous advancement of 5G technology, optical communication technology will be more widely used. The development of optical communication technology not only allows people to enjoy faster network speed, but also brings more opportunities and challenges. For example, new applications such as cloud gaming, VR, and AR require more stable and high-speed networks, and optical communication technology can meet these needs. At the same time, optical communication technology has also brought more innovation opportunities, such as intelligent medical care, intelligent manufacturing and other fields, will use optical communication technology to achieve more efficient and accurate operation. But you know what? This amazing technology cannot be achieved without the credit of macro environmental test equipment, especially the TC temperature cycle test chamber, which is a rapid temperature change test chamber. This article introduces you to the optical communication product reliability test quality manager - rapid temperature change laboratory. First, let's talk briefly about optical communication. Some people also say that it is called optical communication, so they are two in the end is not a concept. In fact, they are two of the same concept. Optical communication is the use of optical signals for communication technology, and optical communication is based on optical communication, through optical devices such as optical fibers, optical cables to achieve data transmission. Optical communication technology is widely used, such as our daily use of fiber optic broadband, mobile phone optical sensors, optical measurement in aerospace and so on. It can be said that optical communication has become an important part of modern communication field. So why is optical communication so popular? In fact, it has many advantages, such as high-speed transmission, large bandwidth, low loss and so on. Common optical communication products include: optical cable, fiber switch, fiber modem, etc., used to transmit and receive optical signals of optical fiber communication equipment; Temperature sensor, strain sensor, displacement sensor, etc., can measure various physical quantities in real time and other optical fiber sensors; Erbium-doped optical amplifier, erbium-doped ytterbium-doped optical amplifier, Raman amplifier, etc., used to expand the intensity of optical signals and other optical amplifiers; Helium-neon laser, diode laser, fiber laser, etc., are light sources in optical communication, used to produce high brightness, directional and coherent laser light and other lasers; Photodetectors, optical limiter, photodiodes, etc., for receiving optical signals and converting them into electrical signals and other optical receivers; Optical switches, optical modulators, programmable optical arrays, etc. are used to control and adjust optical signal transmission and routing and other optical controllers. Let's take mobile phones as an example and talk about the application of optical communication products on mobile phones: 1. Optical fiber: Optical fiber is generally used as a part of the communication line, due to its fast transmission speed, communication signals are not easily affected by external interference and other characteristics, has become an important part of mobile phone communication. 2. Photoelectric converter/optical module: photoelectric converter and optical module are devices that convert optical signals into electrical signals, and are also a very important part of mobile phone communication. In the era of high-speed communication such as 4G and 5G, the speed and performance of such equipment need to be continuously improved to meet the needs of fast and stable communication. 3. Camera module: In the mobile phone, the camera module generally includes CCD, CMOS, optical lens and other parts, and its quality and performance also have a significant impact on the quality of optical communication of the mobile phone. 4. Display: Mobile phone displays generally use OLED, AMOLED and other technologies, the principle of these technologies are related to optics, but also an important part of mobile phone optical communication. 5. Light sensor: Light sensor is mainly used in mobile phones for environmental light sensing, proximity sensing and gesture sensing, and is also an important mobile phone optical communication product. It can be said that optical communication products fill all aspects of our life and work. However, the production and use environment of optical communication products is often changeable, such as high or low temperature weather environment when working outdoors, or the use of a long time will also encounter changes in thermal expansion and contraction. So how is the reliable use of these products achieved? That has to mention our protagonist today - rapid temperature change test chamber, also known as TC box in the optical communication industry. In order to ensure that optical communication products still work normally under various environmental conditions, it is necessary to carry out rapid temperature change tests on optical communication products. The rapid temperature change test chamber can simulate a variety of different temperature and humidity environments, and simulate instantaneous extreme environmental changes in the real world within a rapid range. So how is the rapid temperature change test chamber applied in the optical communication industry? 1. Optical module performance test: Optical module is a key component of optical communication, such as optical transceiver, optical amplifier, optical switch, etc. The rapid temperature change test chamber can simulate different temperature environments and test the performance of the optical module at different temperatures to evaluate its adaptability and reliability. 2. Reliability test of optical devices: optical devices include optical fibers, optical sensors, grating, photonic crystals, photodiodes, etc. The rapid temperature change test chamber can test the temperature change of these optical devices and evaluate their reliability and life based on the test results. 3. Optical communication system simulation test: The rapid temperature change test chamber can simulate various environmental conditions in the optical communication system, such as temperature, humidity, vibration, etc., to test the performance, reliability and stability of the entire system. 4. Technology research and development: The optical communication industry is a technology-intensive industry, which needs to constantly develop new technologies and new products. The rapid temperature change test chamber can be used to test the performance and reliability of new products, helping to accelerate the development and market of new products. In summary, it can be seen that in the optical communication industry, the rapid temperature change test chamber is usually used to test the performance and reliability of optical modules and optical devices. Then when we use the rapid temperature change test chamber for testing, different optical communication products may require different standards. The following are rapid temperature change test standards for some common optical communication products: 1. Optical fiber: Common test standards There are common optical fiber rapid temperature change test standards are the following: IEC 61300-2-22: The standard defines the stability and durability test method of optical fiber components, section 4.3 of which specifies the thermal stability test method of optical fiber components, in the case of rapid temperature changes to the optical fiber components for measurement and evaluation. GR-326-CORE: This standard specifies reliability test requirements for fiber optic connectors and adapters, including thermal stability tests to assess the reliability of fiber optic connectors and adapters in temperature changing environments. GR-468-CORE: This standard defines the performance specifications and test methods for fiber optic connectors, including temperature cycle testing, accelerated aging testing, etc., to verify the reliability and stability of fiber optic connectors under various environmental conditions. ASTM F2181: This standard defines a method for fiber failure testing under high temperature and high humidity environmental conditions to evaluate the long-term durability of the fiber. And the above standards such as GB/T 2423.22-2012 are tested and evaluated for the reliability of optical fiber in rapid temperature changes or long-term high temperature and high humidity environments, which can help the majority of manufacturers to ensure the quality and reliability of optical fiber products. 2. Photoelectric converter/optical module: The common rapid temperature change test standards are GB/T 2423.22-2012, GR-468-CORE, EIA/TIA-455-14 and IEEE 802.3. These standards mainly cover the test methods and specific implementation steps of photoelectric converters/optical modules, which can ensure the performance and reliability of products in different temperature environments. Among them, the GR-468-CORE standard is specifically for the reliability requirements of optical converters and optical modules, including temperature cycle test, wet heat test and other environmental tests, requiring optical converters and optical modules to maintain stable and reliable performance in long-term use. 3. Optical sensor: The common rapid temperature change test standards are GB/T 27726-2011, IEC 61300-2-43 and IEC 61300-2-6. These standards mainly cover the test methods and specific implementation steps of the temperature change test of the optical sensor, which can ensure the performance and reliability of the product in different temperature environments. Among them, the GB/T 27726-2011 standard is the standard for the performance test method of optical sensors in China, including the environmental test method of optical fiber sensors, which requires the optical sensor to maintain stable performance in a variety of working environments. IEC 60749-15 standard is the international standard for the temperature cycle test of electronic components, and it also has reference value for the rapid temperature change test of optical sensors. 4. Laser: Common rapid temperature change test standards are GB/T 2423.22-2012 "Electrical and electronic products environmental test Part 2: Test Nb: temperature cycle test", GB/T 2423.38-2002 "Basic test methods for electrical components Part 38: Temperature resistance test (IEC 60068-2-2), GB/T 13979-2009 "Laser product Performance test method", IEC 60825-1, IEC/TR 61282-10 and other standards mainly cover the laser temperature change test method and specific implementation steps. It can ensure the performance and reliability of products in different temperature environments. Among them, the GB/T 13979-2009 standard is the standard for the performance test method of laser products in China, including the environmental test method of the laser under temperature changes, requiring the laser to maintain stable performance in a variety of working environments. The IEC 60825-1 standard is a specification for the integrity of laser products, and there are also relevant provisions for the rapid temperature change test of lasers. In addition, the IEC/TR 61282-10 standard is one of the guidelines for the design of optical fiber communication systems, which includes methods for the environmental protection of lasers. 5. Optical controller: The common fast temperature change test standards are GR-1209-CORE and GR-1221-CORE. GR-1209-CORE is a reliability standard for optical fiber equipment, mainly for the reliability test of optical connections, and specifies the reliability experiment of optical connection systems. Among them, the rapid temperature cycle (FTC) is one of the test projects, which is to test the reliability of optical fiber modules under rapidly changing temperature conditions. During the test, the optical controller needs to perform temperature cycling in the range of -40 ° C to 85 ° C. During the temperature cycle, the module should maintain normal function and not produce abnormal output, and the test time is 100 temperature cycles. GR-1221-CORE is a reliability standard for fiber optic passive devices and is suitable for the testing of passive devices. Among them, the temperature cycle test is one of the test items, which also requires the optical controller to be tested in the range of -40 ° C to 85 ° C, and the test time is 100 cycles. Both of these standards specify the reliability test of the optical controller in the environment of temperature change, which can determine the stability and reliability of the optical controller under harsh environmental conditions. In general, different rapid temperature change test standards may focus on different test parameters and test methods, it is recommended to choose the corresponding test standards according to the use of specific products. Recently, when we discuss the reliability verification of optical modules, there is a contradictory indicator, the number of temperature cycles of optical module verification, there are 10 times, and 20 times, 100 times, or even 500 times. Frequency definitions in two industry standards: The references to these standards have clear sources and are correct. For the 5G forward optical module, our opinion is that the number of cycles is 500, and the temperature is set at -40 °C ~85 °C The following is the description of the 10/20/100/500 above in the original text of GR-468(2004) Because of the limited space, this article introduces the use of rapid temperature change test chamber in the optical communication industry. If you have any questions when using rapid temperature change test chamber and other environmental test equipment, welcome to discuss with us and learn together.

IEC 60068-2 Combined Condensation and Temperature and Humidity Test In the IEC60068-2 specification, there are a total of five kinds of humid heat tests. In addition to the common 85℃/85%R.H., 40℃/93%R.H. fixed-point high temperature and high humidity, there are two more special tests [IEC60068-2-30, IEC60068-2-38], they are alternating wet and humid cycle and temperature and humidity combined cycle, so the test process will change temperature and humidity. Even multiple groups of program links and cycles applied in IC semiconductors, parts, equipment, etc. To simulate the outdoor condensation phenomenon, evaluate the material's ability to prevent water and gas diffusion, and accelerate the product's tolerance to deterioration, the five specifications are organized into a comparison table of the differences in the wet and heat test specifications, and the main points of the test are explained in detail for the wet and heat combined cycle test, and the test conditions and points of GJB in the wet and heat test are supplemented. IEC60068-2-30 alternating humid heat cycle test Note: This test uses the test technique of maintaining humidity and temperature alternations to make moisture permeate into the sample and produce condensation (condensation) on the surface of the product to confirm the adaptability of the component, equipment or other products in use, transportation and storage under the combination of high humidity and temperature and humidity cycle changes. This specification is also suitable for large test samples. If the equipment and the test process need to keep the power heating components for this test, the effect will be better than IEC60068-2-38, the high temperature used in this test has two (40 °C, 55 °C), the 40 °C is to meet most of the world's high temperature environment, while 55 °C meets all the world's high temperature environment, the test conditions are also divided into [cycle 1, cycle 2], In terms of severity, [Cycle 1] is higher than [Cycle 2]. Suitable for side products: components, equipment, various types of products to be tested Test environment: the combination of high humidity and temperature cyclic changes produces condensation, and three kinds of environments can be tested [use, storage, transportation ([packaging is optional)] Test stress: Breathing causes water vapor to invade Whether power is available: Yes Not suitable for: parts that are too light and too small Test process and post-test inspection and observation: check the electrical changes after moisture [do not take out the intermediate inspection] Test conditions: humidity: 95% R.H. warming] after [humidity maintain (25 + 3 ℃ low temperature - - high temperature 40 ℃ or 55 ℃) Rising and cooling rate: heating (0.14℃/min), cooling (0.08~0.16℃/min) Cycle 1: Where absorption and respiratory effects are important features, the test sample is more complex [humidity not less than 90%R.H] Cycle 2: In the case of less obvious absorption and respiratory effects, the test sample is simpler [humidity is not less than 80%R.H.] IEC60068-2-30 Alternating temperature and humid test (condensation test) Note: For component types of parts products, a combination test method is used to accelerate the confirmation of the test sample's tolerance to degradation under high temperature, high humidity and low temperature conditions. This test method is different from the product defects caused by respiration [dew, moisture absorption] of IEC60068-2-30. The severity of this test is higher than that of other humid heat cycle tests, because there are more temperature changes and [respiration] during the test, and the cycle temperature range is larger [from 55℃ to 65℃]. The temperature variation rate of the temperature cycle also becomes faster [temperature rise :0.14℃/min becomes 0.38℃/min, 0.08℃/min becomes 1.16 ℃/min]. In addition, different from the general humid heat cycle, the low temperature cycle condition of -10℃ is increased, which accelerates the breathing rate and makes the water condensing in the gap of the substitute icing. Is the characteristic of this test specification, the test process allows power and load power test, but can not affect the test conditions (temperature and humidity fluctuation, rising and cooling rate) because of the heating of the side product after power, due to the change of temperature and humidity during the test process, but the top of the test chamber can not condenses water droplets to the side product. Suitable for side products: components, metal components sealing, lead end sealing Test environment: combination of high temperature, high humidity and low temperature conditions Test stress: accelerated breathing + frozen water Whether it can be powered on: it can be powered on and external electric load (it can not affect the conditions of the test chamber because of power heating) Not applicable: Can not replace moist heat and alternating humid heat, this test is used to produce defects different from respiration Test process and post-test inspection and observation: check the electrical changes after moisture [check under high humidity conditions and take out after test] Test conditions: damp temperature and humidity cycle (25 ↔ 65 + 2 ° C / 93 + 3% r.h.) - low temperature cycle (25 ↔ 65 + 2 ℃ / 93 + 3% r.h. -- 10 + 2 ° C) X5 cycle = 10 cycle Rising and cooling rate: heating (0.38℃/min), cooling (1.16 °C/min) GJB150-o9 humid heat test Description: The wet and heat test of GJB150-09 is to confirm the ability of equipment to withstand the influence of hot and humid atmosphere, suitable for equipment stored and used in hot and humid environment, equipment prone to high humidity storage or use, or equipment may have potential problems related to heat and humidity. Hot and humid locations may occur throughout the year in tropical areas, seasonal occurrences in mid-latitudes, and in equipment subjected to comprehensive changes in pressure, temperature and humidity. The specification specifically emphasizes 60 ° C /95%R.H. This high temperature and humidity does not occur in nature, nor does it simulate the humid and thermal effect after solar radiation, but it can find potential problems in the equipment. However, it is not possible to reproduce complex temperature and humidity environments, assess long-term effects, and reproduce humidity effects associated with low humidity environments.  

IEC 60068-2   Instructions: IEC(International Electrotechnical Association) is the world's oldest non-governmental international electrical standardization organization, for the people's livelihood of the electronic products to develop relevant test specifications and methods, such as: mainframe board, notebook computers, tablets, smartphones, LCD screens, game consoles... The main spirit of its test is extended from IEC, the main representative of which is IEC60068-2, environmental test conditions its [environmental test] refers to the sample exposed to natural and artificial environments, but the performance of its actual use, transportation and storage conditions are evaluated. The environmental test of the sample can be uniform and linear through the use of standardized standards. Environmental testing can simulate whether the product can adapt to environmental changes (temperature, humidity, vibration, temperature change, temperature shock, salt spray, dust) at different stages (storage, transport, use). And verify that the characteristics and quality of the product itself will not be affected by it, low temperature, high temperature, temperature impact can produce mechanical stress, this stress makes the test sample more sensitive to the subsequent test, impact, vibration can produce mechanical stress, this stress can make the sample immediately damaged, air pressure, alternating humid heat, constant humid heat, corrosion application of these tests and can be continued thermal and mechanical stress test effects. Important IEC specification sharing: IEC69968-2-1- Cold Test purpose: To test the ability of automotive components, equipment or other component products to operate and store at low temperatures. Test methods are divided into: 1.Aa: Temperature sudden change method for non-thermal specimens 2.Ab: Temperature gradient method for non-thermal specimens 3.Ad: Temperature gradient method of thermogenic specimen Note: Aa: 1. Static test (without power supply). 2. First cool down to the specified temperature of the specification before placing the test part. 3. After stability, the temperature difference of each point on the specimen does not exceed ±3℃. 4. After the test is completed, the specimen is placed under standard atmospheric pressure until the fog is completely removed: no voltage is added to the specimen during the transfer process. 5. Measure after returning to the original condition (at least 1hr). Ab: 1. Static test (without power supply). 2. The specimen is placed in the cabinet at room temperature, and the temperature change of the cabinet temperature does not exceed 1℃ per minute. 3. The specimen shall be kept in the cabinet after the test, and the temperature change of the cabinet temperature shall not exceed 1℃ per minute to return to the standard atmospheric pressure; The specimen should not be charged during temperature change. 4. Measure after returning to the original condition (at least 1hr). (The difference between the temperature and the air temperature is more than 5℃). Ac: 1. Dynamic test (plus power supply) when the temperature of the specimen is stable after charging, the temperature of the specimen surface is the most hot spot. 2. The specimen is placed in the cabinet at room temperature, and the temperature change of the cabinet temperature does not exceed 1℃ per minute. 3. The specimen should be kept in the cabinet after the test, and the temperature change of the cabinet temperature should not exceed 1℃ per minute, and return to the standard atmospheric pressure; The specimen should not be charged during temperature change. 4. Measure after returning to the original condition (at least 1hr). Test conditions: 1. Temperature :-65,-55,-40,-25,-10,-5,+5°C 2. Resident time :2/16/72/96 hours. 3. Temperature variation rate: no more than 1℃ per minute. 4. Tolerance error :+3°C. Test setup: 1. Heat generating specimens should be placed in the center of the test cabinet and the wall of the cabinet > 15cm Sample to specimen > 15cm test cabinet to test volume ratio > 5:1. 2. For heat-generating specimens, if air convection is used, the flow rate should be kept to a minimum. 3. The specimen should be unpacked, and the fixture should have the characteristics of high heat conduction.   IEC 60068-2-2- Dry heat Test purpose: To test the ability of components, equipment or other component products to operate and store in high temperature environments. The test method is: 1. Ba: Temperature sudden change method for non-thermal specimens 2.Bb: Temperature gradient method for non-thermal specimens 3.Bc: Temperature sudden change method for thermogenic specimens 4.Bd: Temperature gradient method for thermogenic specimens Note: Ba: 1. Static test (without power supply). 2. First cool down to the specified temperature of the specification before placing the test part. 3. After stability, the temperature difference of each point on the specimen does not exceed +5℃. 4. After the test is completed, place the specimen under standard atmospheric pressure and return to the original condition (at least 1hr). Bb: 1. Static test (without power supply). 2. The specimen is placed in the cabinet at room temperature, and the temperature change of the cabinet temperature does not exceed 1℃ per minute, and the temperature is reduced to the temperature value specified in the specification. 3. The specimen shall be kept in the cabinet after the test, and the temperature change of the cabinet temperature shall not exceed 1℃ per minute to return to the standard atmospheric pressure; The specimen should not be charged during temperature change. 4. Measure after returning to the original condition (at least 1hr). Bc: 1. Dynamic test (external power supply) When the temperature of the specimen is stable after charging, the difference between the temperature of the hottest spot on the surface of the specimen and the air temperature is more than 5℃. 2. Heat up to the specified temperature of the specification before placing the test part. 3. After stability, the temperature difference of each point on the specimen does not exceed +5℃. 4. After the test is completed, the specimen will be placed under the standard atmospheric pressure, and the measurement will be carried out after the original condition is returned (at least 1hr). 5. The average temperature of the decimal point on the plane of 0~50mm on the bottom surface of the specimen. Bd: 1. Dynamic test (external power supply) when the temperature of the specimen is stable after charging, the temperature of the most hot spot on the surface of the specimen is more than 5°C different from the air temperature. 2. The specimen is placed in the cabinet at room temperature, and the temperature change of the cabinet temperature does not exceed 1℃ per minute, and rises to the specified temperature value. 3. Return to standard atmospheric pressure; The specimen should not be charged during temperature change. 4. Measure after returning to the original condition (at least 1hr). Test conditions: 1. The temperature 1000,800,630,500,400,315,250,200,175,155,125,100,85,70,55,40,30 ℃. 1. Resident time: 2/16/72/96 hours. 2. Temperature variation rate: no more than 1℃ per minute. (Average in 5 minutes) 3. Tolerance error: tolerance of ±2℃ below 200℃. (200~1000℃ tolerance ±2%)   IEC 60068-2-2- Test method Ca: Steady damp heat 1. Test purpose: The purpose of this test method is to determine the adaptability of components, equipment or other products to operation and storage at constant temperature and high relative humidity. Step 2: Scope This test method can be applied to both heat-dissipating and non-heat-dissipating specimens. 3. No limits 4. Test steps: 4.1 Specimens shall be inspected visually, electrically and mechanically in accordance with relevant specifications before testing. 4.2 The test specimen must be placed in the test cabinet in accordance with the relevant specifications. In order to avoid the formation of water droplets on the test specimen after it is placed in the cabinet, it is best to preheat the temperature of the test specimen to the temperature condition in the test cabinet in advance. 4.3 The specimen shall be insulated in accordance with the specified residence. 4.4 If specified in the relevant specifications, functional tests and measurements shall be performed during or after the test, and the functional tests shall be performed in accordance with the cycle required in the specifications, and the test pieces shall not be moved out of the test cabinet. 4.5 After the test, the specimen must be placed under standard atmospheric conditions for at least one hour and at most two hours to return to its original condition. Depending on the characteristics of the specimen or the different laboratory energy, the specimen can be removed or retained in the test cabinet to wait for recovery, if you want to remove the time to be as short as possible, preferably not more than five minutes, if maintained in the cabinet the humidity must be reduced to 73% to 77% R.H. within 30 minutes, while the temperature must also reach the laboratory temperature within 30 minutes +1℃ range. 5. Test conditions 5.1 Test temperature: The temperature in the test cabinet should be controlled within the range of 40+2°C. 5.2 Relative humidity: The humidity in the test cabinet should be controlled at 93(+2/-3)% R.H. Within the range. 5.3 Resident time: The resident time can be 4 days, 10 days, 21 days or 56 days. 5.4 Test tolerance: temperature tolerance is +2℃, error of packet content measurement, slow change of temperature and temperature difference in the temperature cabinet. However, in order to facilitate the maintenance of humidity within a certain range, the temperature of any two points in the test cabinet should be maintained within the minimum range as far as possible at any time. If the temperature difference exceeds 1 ° C, the humidity changes beyond the permissible range. Therefore, even short-term temperature changes may need to be controlled within 1 ° C. 6. Test setup 6.1 Temperature and humidity sensing devices must be installed in the test cabinet to monitor the temperature and humidity in the cabinet. 6.2 There shall be no condensation water droplets on the test specimen at the top or wall of the test cabinet. 6.3 The condensed water in the test cabinet must be discharged continuously and shall not be used again unless it is purified (re-purifed). 6.4 When the humidity in the test cabinet is achieved by spraying water into the test cabinet, the moisture resistance coefficient shall not be less than 500Ω. 7. Other 7.1 The temperature and humidity conditions in the test cabinet must be uniform and similar to those in the vicinity of the temperature and humidity sensor. 7.2 The temperature and humidity conditions in the test cabinet shall not be changed during the power-on or functional test of the specimen. 7.3 Precautions to be taken when removing moisture from the specimen surface shall be detailed in the relevant specifications.   IEC 68-2-14 Test method N: Temperature variation 1. Test purpose The purpose of this test method is to determine the effect of the specimen on the environment of temperature change or continuous temperature change. Step 2: Scope This test method can be divided into: Test method Na: Rapid temperature change within a specified time Test method Nb: Temperature change at specified temperature variability Test method Nc: Rapid temperature change by double liquid immersion method. The first two items apply to components, equipment or other products, and the third item applies to glass-metal seals and similar products. Step 3 Limit This test method does not validate high or low temperature environmental effects, and if such conditions are to be validated, "IEC68-2-1 test Method A:" cold "or "IEC 60068-2-2 Test Method B: dry heat" should be used. 4. Test procedure 4.1 Test method Na: Rapid temperature change in a specific time 4.1.1 Specimens shall be inspected visually, electrically and mechanically in accordance with relevant specifications before testing. 4.1.2 The specimen type shall be unpacked, unpowered and ready for use or other conditions specified in relevant specifications. The initial condition of the specimen was room temperature in the laboratory. 4.1.3 Adjust the temperature of the two temperature cabinets respectively to the specified high and low temperature conditions. 4.1.4 Place the specimen in the low-temperature cabinet and keep it warm according to the specified residence time. 4.1.5 Move the specimen into the high-temperature cabinet and keep it warm according to the specified residence time. 4.1.6 The transfer time of high and low temperature shall be subject to the test conditions. 4.1.7 Repeat the procedure of Steps 4.1.4 and 4.1.5 four times 4.1.8 After the test, the specimen should be placed under standard atmospheric conditions and kept for a certain time to make the specimen reach temperature stability. The response time shall refer to the relevant regulations. 4.1.9 After the test, the specimens shall be inspected visually, electrically and mechanically in accordance with relevant specifications. 4.2 Test method Nb: Temperature change at a specific temperature variability 4.2.1 The specimens shall be inspected visually, electrically and mechanically in accordance with relevant specifications before testing. 4.2.2 Place the test piece in the temperature cabinet. The shape of the test piece should be unpacked, unpowered and ready for use or other conditions specified in relevant specifications. The initial condition of the specimen was room temperature in the laboratory. The specimen can be made operational if required by the relevant specification. 4.2.3 The temperature of the cabinet shall be lowered to the prescribed low temperature condition, and the insulation shall be carried out according to the prescribed residence time 4.2.4 The temperature of the cabinet shall be raised to the specified high temperature condition, and heat preservation shall be carried out according to the specified residence time 4.2.5 The temperature variability of high and low temperature shall be subject to the test conditions. 4.2.6 Repeat the procedure in Steps 4.2.3 and 4.2.4: Electrical and mechanical tests shall be performed during the test. Record the time used for electrical and mechanical testing. After the test, the specimen should be placed under standard atmospheric conditions and kept for a certain time to make the specimen reach the temperature stability recovery time referred to the relevant specifications. After the test, the specimens shall be inspected visually, electrically and mechanically in accordance with the relevant specifications 5. Test conditions Test conditions can be selected by the following appropriate temperature conditions and test time or in accordance with the relevant specifications, 5.1 Test method Na: Rapid temperature change in a specific time High temperature: 1000800630500400315250200175155125100,85,70,55,4030 ° C Low temperature :-65,-55,-40,-25.-10.-5 °C Humidity: Vapor content per cubic meter of air should be less than 20 grams (equivalent to 50% relative humidity at 35 ° C). Residence time: The temperature adjustment time of the temperature cabinet can be 3 hours, 2 hours, 1 hour, 30 minutes or 10 minutes, if there is no provision, it is set to 3 hours. After the test piece is placed in the temperature cabinet, the temperature adjustment time cannot exceed one-tenth of the residence time. Transfer time: manual 2~3 minutes, automatic less than 30 seconds, small specimen less than 10 seconds. Number of cycles :5 cycles. Test tolerance: The tolerance of temperature below 200℃ is +2℃ The tolerance of the temperature between 250 and 1000C is +2% of the test temperature. If the size of the temperature cabinet cannot meet the above tolerance requirements, the tolerance can be relaxed: the tolerance of the temperature below 100 ° C is ±3 ° C, and the tolerance of the temperature between 100 and 200 ° C is ±5 ° C (the tolerance relaxation should be indicated in the report). 5.2 Test method Nb: Temperature change at a specific temperature variability High temperature: 1000800630500400315250200175155125100,85,70 55403 0 'C Low temperature :-65,-55,-40,-25,-10,-5,5℃ Humidity: Vapor per cubic meter of air should be less than 20 grams (equivalent to 50% relative humidity at 35 ° C) Residence time: including rising and cooling time can be 3 hours, 2 hours, 1 hour, 30 minutes or 10 minutes, if there is no provision, set to 3 hours. Temperature variability: The average temperature fluctuation of the temperature cabinet within 5 minutes is 1+0.2 ° C /min, 3+0.6 ° C /min, or 5+1 ° C /min. Number of cycles :2 cycles. Test tolerance: The tolerance of temperature below 200℃ is +2℃. The tolerance of the temperature between 250 and 1000℃C is +2% of the test temperature. If the size of the temperature cabinet cannot meet the above tolerance requirements, the tolerance can be relaxed. The tolerance of the temperature below 100 ° C is +3 ° C. The temperature between 100 ° C and 200 ° C is +5 ° C. (The tolerance relaxation should be indicated in the report). 6. Test setup 6.1 Test method Na: Rapid temperature change in a specific time The difference between the inner wall temperature of the high and low temperature cabinets and the temperature test specifications shall not exceed 3% and 8%(shown in °K) respectively to avoid thermal radiation problems. The thermogenic specimen should be placed in the center of the test cabinet as far as possible, and the distance between the specimen and the cabinet wall, the specimen and the specimen should be greater than 10 cm, and the ratio of the volume of the temperature cabinet and the specimen should be greater than 5:1. 6.2 Test method Nb: Temperature change at a specific temperature variability Specimens shall be inspected visually, electrically and mechanically in accordance with relevant specifications before testing. The specimen shall be in unpacked, unpowered and ready for use condition or other conditions specified in relevant specifications. The initial condition of the specimen was room temperature in the laboratory. Adjust the temperature of the two temperature cabinets respectively to the specified high and low temperature conditions The specimen is placed in a low-temperature cabinet and kept warm according to the specified residence time The specimen is placed in a high temperature cabinet and insulated according to the specified residence time. The transfer time of high and low temperature shall be performed according to the test conditions. Repeat the procedure of steps d and e four times. After the test, the specimen should be placed under standard atmospheric conditions and kept for a certain time to make the specimen reach the temperature stability recovery time referred to the relevant specifications. After the test, the specimens shall be inspected visually, electrically and mechanically in accordance with the relevant specifications 6.3 Test method NC: Rapid temperature change of double liquid soaking method The liquid used in the test shall be compatible with the specimen and shall not harm the specimen. 7. Others 7.1 Test method Na: Rapid temperature change in a specific time When the specimen is placed in the temperature cabinet, the temperature and air flow rate in the cabinet must reach the specified temperature specification and tolerance within one-tenth of the holding time. The air in the cabinet must be maintained in a circle, and the air flow rate near the specimen must not be less than 2 meters per second (2m/s). If the specimen is transferred from the high or low temperature cabinet, the holding time cannot be completed for some reason, it will stay in the previous holding state (preferably at low temperature). 7.2 Test method Nb: The air in the cabinet must be maintained in a circle at a specific temperature variability, and the air flow rate near the specimen must not be less than 2 meters per second (2m/s). 7.3 Test method NC: Rapid temperature change of double liquid soaking method When the specimen is immersed in the liquid, it can be quickly transferred between the two containers, and the liquid cannot be stirred.  

IEEE1513 Temperature Cycle Test and Wet Freezing Test, Humidity Heat Test 2 Steps: Both modules will perform 200 cycle temperature cycles between -40 °C and 60 °C or 50 cycle temperature cycles between -40 °C and 90 °C, as specified in ASTM E1171-99. Note: ASTM E1171-01: Test method for photoelectric modulus at Loop Temperature and humidity Relative humidity does not need to be controlled. The temperature variation should not exceed 100℃/ hour. The residence time should be at least 10 minutes and the high and low temperature should be within the requirement of ±5℃ Requirements: a. The module will be inspected for any obvious damage or degradation after the cycle test. b. The module should not show any cracks or warps, and the sealing material should not delaminate. c. If there is a selective electrical function test, the output power should be 90% or more under the same conditions of many original basic parameters Added: IEEE1513-4.1.1 Module representative or receiver test sample, if a complete module or receiver size is too large to fit into an existing environmental test chamber, the module representative or receiver test sample may be substituted for a full-size module or receiver. These test samples should be specially assembled with a replacement receiver, as if containing a string of cells connected to a full-size receiver, the battery string should be long and include at least two bypass diodes, but in any case three cells are relatively few, which summarizes the inclusion of links with the replacement receiver terminal should be the same as the full module. The replacement receiver shall include components representative of the other modules, including lens/lens housing, receiver/receiver housing, rear segment/rear segment lens, case and receiver connector, procedures A, B, and C will be tested. Two full-size modules should be used for outdoor exposure test procedure D. IEEE1513-5.8 Humidity freeze cycle test Humidity freeze cycle test Receiver Purpose: To determine whether the receiving part is sufficient to resist corrosion damage and the ability of moisture expansion to expand the material molecules. In addition, frozen water vapor is the stress for determining the cause of failure Procedure: The samples after temperature cycling will be tested according to Table 3, and will be subjected to wet freezing test at 85 ℃ and -40 ℃, humidity 85%, and 20 cycles. According to ASTM E1171-99, the receiving end with large volume shall refer to 4.1.1 Requirements: The receiving part shall meet the requirements of 5.7. Move out of the environment tank within 2 to 4 hours, and the receiving part should meet the requirements of the high-voltage insulation leakage test (see 5.4). module Purpose: Determine whether the module has sufficient capacity to resist harmful corrosion or widening of material bonding differences Procedure: Both modules will be subjected to wet freezing tests for 20 cycles, 4 or 10 cycles to 85 ° C as shown in ASTM E1171-99. Please note that the maximum temperature of 60 ° C is lower than the wet freezing test section at the receiving end. A complete high voltage insulation test (see 5.4) will be completed after a two to four hour cycle. Following the high voltage insulation test, the electrical performance test as described in 5.2 will be carried out. In large modules may also be completed, see 4.1.1. Requirements: a. The module will check for any obvious damage or degradation after the test, and record any. b. The module should exhibit no cracking, warping, or severe corrosion. There should be no layers of sealing material. c. The module shall pass the high voltage insulation test as described in IEEE1513-5.4. If there is a selective electrical function test, the output power can reach 90% or more under the same conditions of many original basic parameters IEEE1513-5.10 Damp heat test IEEE1513-5.10 Damp heat test Objective: To evaluate the effect and ability of receiving end to withstand long-term moisture infiltration. Procedure: The test receiver is tested in an environmental test chamber with 85%±5% relative humidity and 85 ° C ±2 ° C as described in ASTM E1171-99. This test should be completed in 1000 hours, but an additional 60 hours can be added to perform a high voltage insulation leakage test. The receiving part can be used for testing. Requirements: The receiving end needs to leave the damp heat test chamber for 2 ~ 4 hours to pass the high voltage insulation leakage test (see 5.4) and pass the visual inspection (see 5.1). If there is a selective electrical function test, the output power should be 90% or more under the same conditions of many original basic parameters. IEEE1513 Module test and inspection procedures IEEE1513-5.1 Visual inspection procedure Purpose: To establish the current visual status so that the receiving end can compare whether they pass each test and guarantee that they meet the requirements for further testing. IEEE1513-5.2 Electrical performance test Objective: To describe the electrical characteristics of the test module and the receiver and to determine their peak output power. IEEE1513-5.3 Ground continuity test Purpose: To verify electrical continuity between all exposed conductive components and the grounding module. IEEE1513-5.4 Electrical isolation test (dry hi-po) Purpose: To ensure that the electrical insulation between the circuit module and any external contact conductive part is sufficient to prevent corrosion and safeguard the safety of workers. IEEE1513-5.5 Wet insulation resistance test Purpose: To verify that moisture cannot penetrate the electronically active part of the receiving end, where it could cause corrosion, ground failure, or identify hazards for human safety. IEEE1513-5.6 Water spray test Objective: The field wet resistance test (FWRT) evaluates the electrical insulation of solar cell modules based on humidity operating conditions. This test simulates heavy rain or dew on its configuration and wiring to verify that moisture does not enter the array circuit used, which can increase corrosiveness, cause ground failures, and create electrical safety hazards for personnel or equipment. IEEE1513-5.7 Thermal cycle test (Thermal cycle test) Objective: To determine whether the receiving end can properly withstand the failure caused by the difference in thermal expansion of parts and joint materials. IEEE1513-5.8 Humidity freeze cycle test Objective: To determine whether the receiving part is sufficiently resistant to corrosion damage and the ability of moisture expansion to expand the material molecules. In addition, frozen water vapor is the stress for determining the cause of failure. IEEE1513-5.9 Robustness of terminations test Purpose: To ensure the wires and connectors, apply external forces on each part to confirm that they are strong enough to maintain normal handling procedures. IEEE1513-5.10 Damp heat test (Damp heat test) Objective: To evaluate the effect and ability of receiving end to withstand long-term moisture infiltration. I EEE1513-5.11 Hail impact test Objective: To determine whether any component, especially the condenser, can survive hail. IE EE1513-5.12 Bypass diode thermal test (Bypass diode thermal test) Objective: To evaluate the availability of sufficient thermal design and use of bypass diodes with relative long-term reliability to limit the adverse effects of module thermal shift diffusion. IEEE1513-5.13 Hot-spot endurance test (Hot-Spot endurance test) Objective: To assess the ability of modules to withstand periodic heat shifts over time, commonly associated with failure scenarios such as severely cracked or mismatched cell chips, single point open circuit failures, or uneven shadows (shaded portions). I EEE1513-5.14 Outdoor exposure test (Outdoor exposure test) Purpose: In order to preliminarily assess the capability of the module to withstand exposure to outdoor environments (including ultraviolet radiation), the reduced effectiveness of the product may not be detected by laboratory testing. IEEE1513-5.15 Off-axis beam damage test Purpose: To ensure that any part of the module is destroyed due to module deviation of the concentrated solar radiation beam.  

Reliability - Environment Reliability analysis is based on quantitative data as the basis of product quality, through the experimental simulation, the product in a given time, specific use of environmental conditions, the implementation of specific specifications, the probability of successful completion of work objectives, to quantitative data as the basis for product quality assurance. Among them, environmental testing is a common analysis item in reliability analysis. Environmental reliability testing is a test performed to ensure that the functional reliability of a product is maintained during the specified life period, under all circumstances in which it is intended to be used, transported or stored. The specific test method is to expose the product to natural or artificial environmental conditions, to evaluate the performance of the product under the environmental conditions of actual use, transportation and storage, and to analyze the impact of environmental factors and their mechanism of action. Sembcorp's Nanoreliability Analysis laboratory mainly evaluates IC reliability by increasing temperature, humidity, bias, analog IO and other conditions, and selecting conditions to accelerate aging according to IC design requirements. The main test methods are as follows: TC temperature cycle test Experimental standard: JESD22-A104 Objective: To accelerate the effect of temperature change on the sample Test procedure: The sample is placed in a test chamber, which cycles between specified temperatures and is held at each temperature for at least ten minutes. The temperature extremes depend on the conditions selected in the test method. The total stress corresponds to the number of cycles completed at the specified temperature. capacity of equipment Temperature Range  -70℃—+180℃ Temperature Change Rate 15℃/min linear Internal Volume   160L Internal Dimension  W800*H500 * D400mm External Dimension W1000 * H1808 * D1915mm Quantity of sample  25 / 3lot Time/pass   700 cycles / 0 Fail2300 cycles / 0 Fail BLT high temperature bias test Experimental standard: JESD22-A108 Objective: The influence of high temperature bias on samples Test process: Put the sample into the experimental chamber, set the specified voltage and current limit value in power supply, try run at room temperature, observe whether the limited current occurs in power supply, measure whether the input chip terminal voltage meets the expectation, record the current value at room temperature, and set the specified temperature in chamber. When the temperature is stable at the set value, power on at high temperature and record the high temperature current value Equipment capacity: Temperature Range  +20℃—+300℃ Internal Volume   448L Internal Dimension  W800*H800 * D700mm External Dimension W1450 * H1215 * D980mm Quantity of sample  25 / 3lot Time/pass   Case Temperature 125℃ ,1000hrs/ 0 Fail HAST highly accelerated stress test Experimental standard: JESD22-A110/A118 (EHS-431ML, EHS-222MD) Objective: HAST provides constant multiple stress conditions, including temperature, humidity, pressure, and bias. Carried out to assess the reliability of non-enclosed packaged equipment operating in humid environments. Multiple stress conditions can accelerate the infiltration of moisture through the encapsulation mold compound or along the interface between the external protective material and the metal conductor passing through the encapsulation. When water reaches the surface of the bare piece, the applied potential sets up an electrolytic condition that corrodes the aluminum conductor and affects the DC parameters of the device. Contaminants present on the chip surface, such as chlorine, can greatly accelerate the corrosion process. In addition, too much phosphorus in the passivation layer can also react under these conditions. Device 1 and device 2 Equipment capacity: Quantity of sample  25 / 3lot Time/pass   130℃，85%RH ,96hrs/ 0 Fail 110℃，85%RH ,264hrs/ 0 Fail Device 1 Temperature Range -105℃—+142.9℃ Humidity Range  75%RH—100%RH Pressure Range  0.02—0.196MPa Internal Volume   51L Internal Dimension  W355*H355 * D426mm External Dimension W860 * H1796 * D1000mm Device 2 Temperature Range -105℃—+142.9℃ Humidity Range  75%RH—100%RH Pressure Range  0.02—0.392MPa Internal Volume   180L Internal Dimension  W569*H560 * D760mm External Dimension W800 * H1575 * D1460mm THB temperature and humidity cycle test Experimental standard: JESD22-A101 Objective: The influence of temperature and humidity change on the sample Experimental process: Put the sample into the experimental chamber, set the specified voltage and current limit value in power supply, try run at room temperature, observe whether the limited current occurs in power supply, measure whether the input chip terminal voltage meets the expectation, record the current value at room temperature, and set the specified temperature in chamber. When the temperature is stable at the set value, power on at high temperature and record the high temperature current value Equipment capacity: Temperature Range -40℃—+180℃ Humidity Range  10%RH—98%RH Temperature Conversion Rate 3℃/min Internal Volume   784L Internal Dimension  W1000*H980 * D800mm External Dimension W1200 * H1840 * D1625mm Quantity of sample  25 / 3lot Time/pass   85℃，85%RH ,1000hrs/ 0 Fail Procedure temperature and humidity cycle, there has no humidity when temperature over 100℃  TSA&TSB temperature shock test Experimental standard: JESD22-A106 Objective: To accelerate the effect of temperature change on the sample Test process: The sample is put into the test chamber, and the specified temperature is set inside the chamber. Before heating up, it is confirmed that the sample has been fixed on the mold, which has prevented damage due to the sample falling into the chamber during the experiment. Equipment capacity:   TSA  TSB Temperature Range -70℃—+200℃  -65℃—+200℃ Temperature Change Rate ≤5min   ＜20S Internal Volume 70L  4.5L    Internal Dimension　  W410*H460 * D3700mm   W150*H150 * D200mm External Dimension W1310 * H1900 * D1770mm  W1200 * H1785 * D1320mm  

Solar Module EVA Film Introduction 1 In order to improve the power generation efficiency of solar cell modules, provide protection against the loss caused by environmental climate change, and ensure the service life of solar modules, EVA plays a very important role. EVA is non-adhesive and anti-adhesive at room temperature. After hot pressing under certain conditions during the solar cell packaging process, EVA will produce melt bonding and adhesive curing. The cured EVA film becomes completely transparent and has quite high light transmittance. The cured EVA can withstand atmospheric changes and has elasticity. The solar cell wafer is wrapped and bonded with the upper glass and lower TPT by vacuum lamination technology. Basic functions of EVA film: 1. Secure the solar Cell and connecting circuit wires to provide cell insulation protection 2. Perform optical coupling 3. Provide moderate mechanical strength 4. Provide a heat transfer pathway EVA Main features: 1. Heat resistance, low temperature resistance, moisture resistance and weather resistance 2. Good followability to metal glass and plastic 3. Flexibility & Elasticity 4. High light transmission 5. Impact resistance 6. Low temperature winding Thermal conductivity of solar cell related materials: (K value of thermal conductivity at 27 ° C (300'K)) Description: EVA is used for the combination of solar cells as a follow-up agent, because of its strong follow-up ability, softness and elongation, it is suitable for joining two different expansion coefficient materials. Aluminum: 229 ~ 237 W/(m·K) Coated aluminum alloy: 144 W/(m·K) Silicon wafer: 80 ~ 148 W/(m·K) Glass: 0.76 ~ 1.38 W/(m·K) EVA: 0.35W /(m·K) TPT: 0.614 W/(m·K) EVA appearance inspection: no crease, no stain, smooth, translucent, no stain edge, clear embossing EVA material performance parameters: Melting index: affects the enrichment rate of EVA Softening point: The temperature point at which EVA begins to soften Transmittance: There are different transmittance for different spectral distributions, which mainly refers to the transmittance under the spectral distribution of AM1.5 Density: density after bonding Specific heat: the specific heat after bonding, reflecting the size of the temperature increase value when the EVA after bonding absorbs the same heat Thermal conductivity: thermal conductivity after bonding, reflecting the thermal conductivity of EVA after bonding Glass transition temperature: reflects the low temperature resistance of EVA Breaking tension strength: The breaking tension strength of EVA after bonding reflects the mechanical strength of EVA after bonding Elongation at break: the elongation at break at EVA after bonding reflects the tension of EVA after bonding Water absorption: It directly affects the sealing performance of battery cells Binding rate: The binding rate of EVA directly affects his impermeability Peel strength: reflects the bond strength between EVA and peel EVA reliability test purpose: to confirm the weather resistance, light transmission, bonding force, ability to absorb deformation, ability to absorb physical impact, damage rate of pressing process of EVA... Let's wait. EVA aging test equipment and projects: constant temperature and humidity test chamber (high temperature, low temperature, high temperature and high humidity), high and low temperature chamber (temperature cycle), ultraviolet testing machine (UV) VA Model 2: Glass /EVA/ conductive copper sheet /EVA/ glass composite Description: Through the on-resistance electrical measurement system, the low resistance in EVA is measured. Through the change of the on-resistance value during the test, the water and gas penetration of EVA is determined, and the oxidation corrosion of copper sheet is observed. After three tests of temperature cycle, wet freezing and wet heat, the characteristics of EVA and Backsheet change: (↑ : up, ↓ : down) After three tests of temperature cycle, wet freezing and wet heat, the characteristics of EVA and Backsheet change: (↑ : up, ↓ : down) EVA： Backsheet： Yellow↑ Inner layer yellow ↑ Cracking ↑ Cracks in the inner layer and PET layer ↑ Atomization ↑ Reflectivity ↓ Transparency ↓      

Solar Module EVA Film Introduction 2 EVA-UV test: Description: Test the attenuation ability of EVA to withstand ultraviolet (UV) irradiation, after a long time of UV irradiation, EVA film will appear brown, penetration rate decreased... And so on. EVA environmental test project and test conditions: Humid heat: 85℃ / RH 85%; 1,000 hrs Thermal cycle: -40℃ ~ 85℃; 50 cycles Wet freezing test: -40℃ ~ 85℃ / RH 85%; 10 times UV: 280~385nm/ 1000w/200hrs (no cracking and no discoloration) EVA Test Conditions (NREL) : High temperature test: 95℃ ~ 105℃/1000h Humidity and heat: 85℃/85%R.H./>1000h[1500h] Temperature cycle: -40℃←→85℃/>200Cycles  (No bubbles, no cracking, no desticking, no discoloration, no thermal expansion and contraction) UV aging: 0.72W/m2, 1000 hrs, 60℃(no cracking, no discoloration) Outdoor: > California sunshine for 6 months Example of EVA characteristics change under Damp heat test: Discoloration, atomization, Browning, delamination Comparison of EVA bond strength at high temperature and humidity: Description: EVA film at 65℃/85%R.H and 85℃/85%R.H. The degradation of the bond strength was compared at 65℃/85%R.H under two different wet and hot conditions. After 5000 hours of testing, the degradation benefit is not high, but EVA at 85℃/85%R.H. In the test environment, the adhesion is quickly lost, and there is a significant reduction in bond strength in 250 hours. EVA-HAST unsaturated pressurized vapor test: Objective: Since EVA film needs to be tested for more than 1000 hours at 85℃/85%R.H., which is equal to at least 42 days, in order to shorten the test time and accelerate the test speed, it is necessary to increase the environmental stress (temperature & humidity & pressure) and speed up the test process in the environment of unsaturated humidity (85%R.H.). Test conditions: 110℃/85%R.H./264h EVA-PCT pressure digester test: Objective: The PCT test of EVA is to increase the environmental stress (temperature & humidity) and expose EVA to wetting vapor pressure exceeding one atmosphere, which is used to evaluate the sealing effect of EVA and the moisture absorption status of EVA. Test condition: 121℃/100%R.H. Test time: 80h(COVEME) / 200h(toyal Solar) EVA and CELL bond tensile force test: EVA: 3 ~ 6Mpa Non-EVA material: 15Mpa Additional information from EVA: 1. The water absorption of EVA will directly affect its sealing performance of the battery 2.WVTR < 1×10-6g/m2/day(NREL recommended PV WVTR) 3. The adhesive degree of EVA directly affects its impermeability. It is recommended that the adhesive degree of EVA and cell should be greater than 60% 4. When the bonding degree reaches more than 60%, thermal expansion and contraction will no longer occur 5. The bonding degree of EVA directly affects the performance and service life of the component 6. Unmodified EVA has low cohesion strength and is prone to thermal expansion and contraction leading to chip fragmentation 7.EVA peeling strength: longitudinal ≧20N/cm, horizontal ≧20N/cm 8. The initial light transmittance of the packaging film is not less than 90%, and the internal decline rate of 30 years is not less than 5%